Microsoft Advances Microfluidic Cooling to Boost Chip Power and Data‑Center Efficiency

Microsoft announced progress on a microfluidic cooling technique that channels liquid coolant directly through tiny channels etched onto silicon chips. Lab tests show the method can remove heat up to three times more effectively than traditional cold‑plate systems and cut peak chip temperatures by roughly 65 percent. By delivering cooling straight to the silicon, the approach could enable more powerful processors, tighter server packing, and lower energy use in data centers. Microsoft says the technology may also support future 3‑D chip architectures, though broader deployment will require manufacturing changes and further testing. Leggi di più