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Tags: Chip Technology

DeepSeek seeks $45 B valuation in first venture round as China backs homegrown AI

DeepSeek seeks $45 B valuation in first venture round as China backs homegrown AI
Chinese AI lab DeepSeek is in talks to raise its first venture‑capital round, aiming for a valuation that could climb from $20 billion to $45 billion. Founder Liang Wenfeng, who controls about 90% of the company, is turning to investors after rival firms began poaching key researchers. The round is expected to be led by the state‑backed China Integrated Circuit Industry Investment Fund, with cloud giants Tencent and Alibaba reportedly considering participation. DeepSeek’s efficient large‑language model runs on Huawei chips, positioning it as a strategic asset in Beijing’s push for AI independence. Read more

Family Offices Flood AI Startups with Direct Capital, Bypassing Traditional VCs

Family Offices Flood AI Startups with Direct Capital, Bypassing Traditional VCs
High‑net‑worth families are stepping into the AI arena, investing directly in startups instead of routing money through venture‑capital firms. Arena Private Wealth recently co‑led a $230 million round for AI chip maker Positron, marking a shift toward active participation in early‑stage deals. The move reflects a broader sentiment among family offices: exposure to AI is now a top strategic priority, and missing the wave could be riskier than any single investment loss. Read more

Microsoft Advances Microfluidic Cooling to Boost Chip Power and Data‑Center Efficiency

Microsoft Advances Microfluidic Cooling to Boost Chip Power and Data‑Center Efficiency
Microsoft announced progress on a microfluidic cooling technique that channels liquid coolant directly through tiny channels etched onto silicon chips. Lab tests show the method can remove heat up to three times more effectively than traditional cold‑plate systems and cut peak chip temperatures by roughly 65 percent. By delivering cooling straight to the silicon, the approach could enable more powerful processors, tighter server packing, and lower energy use in data centers. Microsoft says the technology may also support future 3‑D chip architectures, though broader deployment will require manufacturing changes and further testing. Read more